ホーム/製品/セラミック・ヒートシンク/Warpage≤2‰ Ceramic Heat Sink Designed to Meet frequency Communication Signal Equipment Requirements with Surface Roughness 0.3-08 Um and Cooling
Warpage≤2‰ Ceramic Heat Sink Designed to Meet frequency Communication Signal Equipment Requirements with Surface Roughness 0.3-08 Um and Cooling
Model Number:Ceramic Heat Sink/Ceramic Micro Porous Heat Sink
お支払配送条件
Packaging Details:As customer requirements
Delivery Time:7-15 days
支払条件:30% TT 前払い、残高の支払いは出荷前に支払われます。
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Warpage≤2‰ Ceramic Heat Sink Designed to Meet frequency Communication Signal Equipment Requirements with Surface Roughness 0.3-08 Um and Cooling
製品の説明
Product Description: The Ceramic Heat Sink is an advanced thermal management solution designed to effectively dissipate heat in a variety of high-performance applications. Manufactured from premium materials such as Silicon Carbide (SiC), Aluminum Oxide (Al₂O₃), Silicon Dioxide (SiO₂), and Aluminum Carbide (Al₄C₃), this heat sink offers exceptional thermal conductivity ranging from 9 to 180 MW/m.K. This wide range in thermal conductivity allows it to cater to diverse thermal